Industry News
HBM Market Faces Oversupply and Price Decline Risks by 2026
Key pressures emerge from accelerated capacity expansion, technological transitions, and shifting client dynamics
August 1, 2025
Key pressures emerge from accelerated capacity expansion, technological transitions, and shifting client dynamics
Kioxia, spun off from Toshiba’s memory division in 2019, operates independently while Toshiba retains a 40% stake. The rebranded company (merging Japanese “kioku” and Greek “axia”) focuses on flash memory innovation. Though they collaborate on R&D, Kioxia runs autonomously in the competitive semiconductor market.
Micron has officially announced the end-of-life (EOL) phase for DDR4 memory, marking the full transition of all three major DRAM manufacturers (Samsung, SK Hynix, Micron) to DDR5 and more advanced process nodes. This decision will exacerbate supply-demand imbalances, trigger significant price volatility, and profoundly impact the entire industry chain.
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The world’s three major DRAM manufacturers, including Samsung, SK Hynix, and Micron, will stop producing DDR4, Nanya Technology and Winbond Electronics have seen significant gains.
Samsung faces dual pressure from SK Hynix and Chinese competitors, particularly lagging in HBM. Through financing, technological transformation, and external partnerships, Samsung is striving to turn the tide.
