It’s a major vote of confidence! Following a constructive meeting with Prime Minister Anwar Ibrahim on December 2, Intel CEO Pat Gelsinger (Chen Liwu) announced a fresh $208 million (RM860 million) commitment to Malaysia. This significant sum will fuel the expansion of Intel’s assembly and test hubs in Penang and Kulim through 2026.
This isn’t just about dollars; it’s about making Malaysia the heart of Intel’s global packaging operations. The government is wholeheartedly backing this mission, offering tax breaks and special visas to help Malaysia capture an 8% slice of the global chip backend market by 2030.
The world needs AI chips, and the current supply chain is stretched. Intel is stepping up with cutting-edge packaging technologies like EMIB (known for its cost efficiency) and Foveros 3D. They are even opening their doors, ensuring these advanced services work seamlessly with wafers from any foundry.
In a landmark move showing commitment to global partnerships, Intel also recently teamed up with Amkor in South Korea to scale up its AI packaging capacity. Intel is positioning itself not just as a competitor, but as the essential partner ready to build the future of computing for everyone.
